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Seventh Framework Programme project merges key electronics, polymer industry competences
October 8, 2013
By: DAVID SAVASTANO
Editor, Ink World Magazine
Imec and its project partners announced the launch of TERASEL (Thermo-plastically deformable circuits for embedded randomly shaped electronics), a project under the European Union’s Seventh Framework Programme for Information and Communication Technologies (FP7). The overall goal of the project is the development, industrial implementation and application of large-area, cost-effective, randomly shaped electronics and sensor circuit technologies. Conventionally, electronics are made on flat su...
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